U.S. launches new blister packaging film

Tekni-Plex, a US plastics film company, used COC Topaz and chlorofluoroethylene (PCTFE) materials for the first time in the production of high-barrier blister-type composite packaging films, resulting in water vapor transmission rate of blister packs. Greatly reduced. The application of this new type of blister packaging film is pharmaceutical packaging.

Compared with the general PVC and PVDC (polyvinylidene chloride) blocked blister packaging films, the development of cycloolefin copolymers in blister packaging is successful, not only the water vapor transmission rate of the material is very low, but also the thickness can be Thinning, increased rigidity. Among them, the COC thickness ranges from 200 to 350 μm, and the PCTFE thickness ranges from 10 to 10 μm.

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